The OY-203D+ is a Pre-Solder THT AOI system for inspecting placements prior to the soldering process. It will check for correct parts, missing parts, correct polarity, and resistor band colors. By eliminating placement defects from being soldered this will eliminate placement related defects from your rework process.

It uses AI to create the test program in 30 minutes or less.

The OY-500TB+ is a double sided Post-Solder THT AOI system. It will simultaneously inspect for placement defects and solder defects after the soldering process is completed.

It will check the top side for correct parts, missing parts, correct polarity, and resistor band colors on the top side. It will check the bottom for solder defects on the bottom side such as insufficient, bridging, pin holes, and excess solder.

By automating your THT solder joint inspection process, you will benefit immediately from avoiding rework when your process parameters shift in your solder operation.

It uses AI to create the test program in 30 minutes or less.

The ALL IN ONE system. The OY-500C+TB has top side bottom side (pre and post solder) and top side bottom side conformal coating inspection operating simultaneously.

The OY-500C+TB can switch between UV, RGB+White Lighting to accommodate THT boards prior to coating then test them after coating in the same system.

It will check for correct parts, missing parts, correct polarity, and resistor band colors on the top side. It will check for solder defects on the bottom side such as insufficient, bridging, pin holes, and excess solder.

Coating inspection for excess, insufficient, overspray (splashing), bubbles and thickness (under development).

It uses AI to create the test program in 30 minutes or less.